The processing of highly brittle special materials and resins (Ultrasonic)
The machining of highly brittle materials such as silicon, silicon carbide or hardened special glass has always been a particular challenge for the manufacturing industry, because conventional machining methods such as grinding, lapping, polishing and cutting often reach their natural limits here. On the one hand, the tools used must be very hard and abrasive, and on the other hand, these hard, ultra-brittle materials tend to produce uncontrollable chipping, which often makes the resulting workpiece unusable.
This can be remedied by the use of ultrasonic-supported special tools, which perform their work at very high rotational speeds and ultrasonic vibrations coupled into the tool. The ultrasonic oscillation provides an additive supporting pulsating additional movement at the machining zone and thus ensures clearly optimized results.
The Ultrasonic 20 from DMG used at HAM Präzision enables us to machine highly brittle materials with very high precision and exceptional homogeneity. The material spectrum ranges from silicon carbide, monocrystalline silicon and glassy carbon to hardened KG3 glass.
Tell us about your specific problem and our trained team will be happy to take care of it. We are looking forward to being at your side with words and deeds.